Temperatures seem low since firmware update  

Temperatures seem low since firmware update

When I pulled my Mk3 out of the box xmas morning it printed with the supplied PLA beautifully. Our first print was the triceratops skull from the example card and, with no tweaking at all, it printed flawlessly. The first layer laid down well and the layers and movements were undetectable in the detailed texture of the skull plate. I was also very happy with multiple subsequent prints of much simpler parts we modeled and sliced ourselves. Furthermore the back of the first layer would be nearly perfectly smooth and uniform, with no sign of tool movements at all.

Then a couple of days ago I setup the MMU 2.0 kit for it and, in the process, upgraded the firmware to 3.5.1. Ever since doing that it seems like all of my temperatures are about 15% low. Running first-layer tests and even trying to reprint that triceratops, I get almost no adhesion and the layers don't seem to bond together very well any more. If I use the tune feature (or filament profile) to bump the bed from 60* up to 70-75* and the nozzle temp up to 240-250* then the old performance seems to mostly return (though I still see individual lines from the tool movement on each layer, it doesn't melt together to form a single smooth surface like it used to.) Is there something about the firmware update or installation of the MMU that could have thrown the temperature sensor calcuations off by about 15%? Or is there perhaps some other calibration that I screwed up while installing the MMU which the higher temp compensates for? I've tried playing around with the z-level compensation on the first-layer calibration (since the MMU installation had me re-adjust the sensor) but without the higher temps nothing really seems to help. I've also tried some other (silver) PLA that was ordered with the MK3 and it is behaving similarly to worse.