Thermal conductivity
As I'm doing my homework preparing for the delivery of my Prusa i3 MK2 kit, I've been looking through the assembly instructions, knowledge base and forum. I didn't see this topic, but please point me to it if I missed it.
Has anyone considered using Teflon tape or thermal compound when assembling the hotend to eliminate any small pockets of insulating air between components? Teflon tape is good up to 260 degrees C, and begins slowly decomposing at temperatures above that. It could be used on threaded connections.
Automotive anti-sieze/thermal compounds (nickel or especially copper-based) are good to well over 1000 degrees C and could be used on both threaded connections and smooth, clamped joints (thermistors) to eliminate insulating air, but also to help prevent corrosion where dissimilar metals meet.
I realize that this would probably have only a small effect on temperature control and stability, but some of the nozzle-corrosion pictures I've seen make me wonder if preventing those problems could be useful. I also realize that great care would have to be used to clean away ANY excess thermal grease in order to not contaminate the filament path.
Any experience or thoughts on this idea?
Robert
Re: Thermal conductivity
Thermal paste is used between the heat break and the heat sink. It is not required between heat break, heat block and nozzle as there is an excellent mechanical connection between the three parts.
Peter
Please note: I do not have any affiliation with Prusa Research. Any advices given are offered in good faith. It is your responsibility to ensure that by following my advice you do not suffer or cause injury, damage…