Moisture sensivity of diamondback nozzle (PETG)
Hi all,
in order to get around the high-flow nozzle issues with PETG, while getting at least the same wear resistance as the tungston carbide nozzle on my MK3S, I figured the diamonback nozzle would be the best option for me - it comes highly praised, after all 🙂
However, the diamonback nozzle seems to be really finicky in terms of humidity - I get popping noises and small underextrusion errors. The other nozzles don't show this behavior with the same filament, no popping noises and no extrusion problems. I did change the printer profile from HF to standard, of course.
Is this a known issue with the diamondback nozzle? Do I need to explicitly dry [new] filament even in moderate conditions (around 40% humidity most of the year)? The spool in question was out of its plastic wrapping for maybe a day or two...
Thanks,
-Christina
RE: Moisture sensivity of diamondback nozzle (PETG)
Just some thoughts as I don't have that nozzle: Filament is not necessarily dry when it is shipped - possibly even on most spools sold, as bone-dry material gets fairly brittle and difficult to handle. Why would vendors spend extra money for drying if it gives them bad reviews, and "serious" users dry it anyway before use?
I could imagine that the hardened nozzle shows the "symptoms" more clearly e.g. a softer brass nozzle would have a rougher surface that allows the steam to escape earlier. But that's speculation. I can only recommend to get a good drier. The difference can be like night-and-day and (learned this the hard way) it is almost pointless to optimize anything when humidity is the main problem.
RE: Moisture sensivity of diamondback nozzle (PETG)
Thanks for the answer! I actually started looking into filament drying, it's just not fully organized, yet - I'm still taking the spools out of the dryer for printing. I haven't tested dried PETG with the DB nozzle, yet (currently printing ASA which never had this issue) but will report back when I do.
In the meantime, if anyone has this nozzle and can confirm that it's more sensitive to moisture, that would be great!
RE: Moisture sensivity of diamondback nozzle (PETG)
Obxidian. It’s hardened. Works with the same parameters as brass.
Diamondback. Even harder. Thermal conductivity differences require a lot of fiddling with heating and cooling parameters. Expensive.
MK4S/MMU3
RE:
I have the PrintDry system. I have the 4-bay system instead of the 2-bay system.
Thanks for the answer! I actually started looking into filament drying, it's just not fully organized
RE:
Obxidian. It’s hardened. Works with the same parameters as brass.
Diamondback. Even harder. Thermal conductivity differences require a lot of fiddling with heating and cooling parameters. Expensive.
I have the Obxidian 500 HF nozzle, too. After the really bad results with the brass CHT nozzle, I thought the Obxidian 500 would improve the blob issue, and it did, at least a little bit. Still, my overall success rate is about 60%, all other PETG prints fail. I just had a really bad blob which destroyed the fan shroud and somehow managed to get to the top of the heater block:
At this point, I'm not sure how to continue. Another forum mentioned that retractions may suck in air, which leads to popping sounds and extrusion errors, too. The DB nozzle has a very short .4mm bore in comparison to other nozzles, maybe this is part of the issue?
Can someone confirm that standard flow nozzles work fine on the MK4S with PETG in general? If so, I suppose I could also try the Nextruder adapter and get a tungsten carbide nozzle but I'm getting reluctant to throw even more good money after bad...
RE: Moisture sensivity of diamondback nozzle (PETG)
I have the PrintDry system. I have the 4-bay system instead of the 2-bay system.
Thanks for the answer! I actually started looking into filament drying, it's just not fully organized
Thanks for the tip, looks nice! I have something similar, the SpacePi X4, I just need to make room for everything, maybe print some kind of holder for the teflon tubes just above the printer.