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Proper handling of solid state devices  

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John~T
(@johnt)
Eminent Member
Proper handling of solid state devices
Here is the procedure I followed for 40 years in the control industry and still applies to this day:
""Electrostatic Discharge (ESD)
Certain components used in electronic assemblies are sensitive to static electricity and can be damaged by its discharge. Static charges are created when non-conductive materials are separated, such as when plastic bags are picked up or opened, when friction occurs between articles of synthetic clothing, when plastic tapes are dispensed and many other causes.

Destructive static charges are induced on nearby conductors, such as human skin, and delivered in the form of sparks passing between conductors, such as when the surface of printed board assembly is touched by a person having a static charge potential. If touched at the right solder joint or conductive pattern, the circuit board assembly can be damaged as the discharge passes through the conductive pattern to a static sensitive component. It is important to note that usually the static damage level for components cannot be felt by humans. (Less than 3,000 volts.)""

This applied to the IR Sensor board I installed twice with resulting Self Test errors!
Posted : 12/07/2019 6:03 pm
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(@)
Illustrious Member
RE: Proper handling of solid state devices

And then you visit places like Micron and see their engineers tossing DRAM around the room rather than walking it over to the next test bench. lol.

The difference between stuff engineered for consumers (DDR4) and stuff that isn't (IR sensors).

More seriously, the IR sensor is pretty resilient, large scale transistors and diodes rather than microcircuits, and unless you are actively trying to fry it, normal ESD isn't going to kill it.  Most generally it's plugging it in wrong that does the damage.

 

ps: that said, I also take care to not invoke the ESD gods when handling electronics.

 

This post was modified 5 years ago 2 times by --
Posted : 12/07/2019 10:01 pm
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